http://www.electronicsweekly.com/news/business/manufacturing/imec-and-cadence-tape-out-first-5nm-ic-2015-10/ LEUVEN, Belgium and SAN JOSE, Calif., October 7, 2015—Nano-electronics
research center imec and Cadence Design Systems, Inc. (NASDAQ: CDNS)
today announced that the companies completed the first tapeout of a 5nm
test chip using extreme ultraviolet (EUV) as well as 193 immersion
(193i) lithography. To produce this test chip, imec and Cadence
optimized design rules, libraries and place-and-route technology to
obtain optimal power, performance and area (PPA) scaling via Cadence®
Innovus™ Implementation System. Using a processor design, imec and
Cadence successfully taped out a set of designs using EUV lithography as
well as Self-Aligned Quadruple Patterning (SAQP) for 193i lithography,
where metal pitches were scaled from the nominal 32nm pitch down to 24nm
to push the limit of patterning.